Flip chip technologies
| Άλλοι συγγραφείς: | |
|---|---|
| Μορφή: | Βιβλίο |
| Γλώσσα: | English |
| Έκδοση: |
McGraw-Hill
|
| Σειρά: | Electronic packaging and interconection series |
MARC
| LEADER | 00000cam a2200000 i 4500 | ||
|---|---|---|---|
| 001 | 1/12147 | ||
| 010 | |a 0-070-36609-8 | ||
| 035 | |l 10001470 | ||
| 100 | |a 19981005d1995 0grey0105 ba | ||
| 101 | 0 | |a eng | |
| 200 | 1 | |a Flip chip technologies |f John H. Lau, editor | |
| 210 | |a New York |c McGraw-Hill |d 1995 | ||
| 215 | |a xiii,565 p. |c fig., diagr |d 24 cm. | ||
| 225 | 2 | |a Electronic packaging and interconection series | |
| 320 | |a Includes bibliography, index | ||
| 410 | 1 | |t Electronic Packaging and Interconnection Series | |
| 606 | 0 | |a Μικροηλεκτρονική συσκευασία | |
| 606 | 0 | |a Multichip (Μικροηλεκτρονική) | |
| 676 | |a 621.381 046 | ||
| 702 | 1 | |a Lau |b John H. | |
| 709 | |a McGraw-Hill | ||
| 801 | 0 | |a GR |b ΠΑ.Δ.Α. Βιβλιοθήκη Πανεπιστημιούπολης 2 |g AACR2 | |
| 852 | |a INST |b LIBRARY |e 19981009 |h 621.381 046 FLI |p 000007674 |q 000007674 |t BK |y 23 |z 1 | ||
| 901 | |a 000452 | ||
| 909 | |b 011931 | ||
| 970 | |a ΑΡΓΥΡΙΟΥ |b ΛΟΥΚΑΣ |z 1998-10 | ||
Εγγραφή στο Ευρετήριο Αναζήτησης
| _version_ | 1780545235004162049 |
|---|---|
| author2 | Lau John H. |
| author2_role | |
| author2_variant | l j h ljh |
| author_facet | Lau John H. |
| author_sort | Lau John H. |
| building | Campus Library II |
| collection | LIB2 Catalog |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 |
| dewey-ones | 621 |
| dewey-raw | 621.381 046 |
| dewey-search | 621.381 046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 |
| format | Book |
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|
| id | lib2_1/12147 |
| illustrated | Illustrated |
| institution | University of West Attica |
| isbn | 0-070-36609-8 |
| language | English |
| physical | xiii,565 p. fig., diagr 24 cm. |
| publishDate | 1995 |
| publisher | McGraw-Hill |
| record_format | marc |
| series2 | Electronic packaging and interconection series |
| spelling | 19981005d1995 0grey0105 ba eng Flip chip technologies John H. Lau, editor New York McGraw-Hill 1995 xiii,565 p. fig., diagr 24 cm. Electronic packaging and interconection series Includes bibliography, index Electronic Packaging and Interconnection Series Μικροηλεκτρονική συσκευασία Multichip (Μικροηλεκτρονική) 621.381 046 Lau John H. McGraw-Hill GR ΠΑ.Δ.Α. Βιβλιοθήκη Πανεπιστημιούπολης 2 AACR2 INST LIBRARY 19981009 621.381 046 FLI 000007674 000007674 BK 23 1 |
| spellingShingle | Flip chip technologies Μικροηλεκτρονική συσκευασία Multichip (Μικροηλεκτρονική) |
| title | Flip chip technologies |
| title_auth | Flip chip technologies |
| title_full | Flip chip technologies John H. Lau, editor |
| title_fullStr | Flip chip technologies John H. Lau, editor |
| title_full_unstemmed | Flip chip technologies John H. Lau, editor |
| title_short | Flip chip technologies |
| topic | Μικροηλεκτρονική συσκευασία Multichip (Μικροηλεκτρονική) |
| topic_facet | Μικροηλεκτρονική συσκευασία Multichip (Μικροηλεκτρονική) |